Current Collapse Reduction in AlGaN/GaN HEMTs by High-Pressure Water Vapor Annealing

What is it about?

We have demonstrated for the first time a remarkable reduction of current collapse in AlGaN/GaN high-electron-mobility transistors (HEMTs) by high-pressure water vapor annealing (HPWVA). The device subjected to HPWVA exhibited considerably low dynamic ON-resistance (R-ON), suggesting highly improved performance of these devices. Analyses of the results on normalized dynamic RON experiments have shown the elimination of deeper traps by HPWVA, leading to the substantially reduced current collapse. X-ray photoelectron spectroscopy (XPS) studies revealed a significant increase in the oxygen core-level O 1s peak. Moreover, angle-resolved XPS suggested the formation of surface oxide layer. These results indicate that the effective reduction of current collapse in the HPWVA-processed samples is likely due to the incorporation of active oxygen species generated by the HPWV into the AlGaN surface. These oxygen atoms eventually fill up near-surface nitrogen vacancies and promote the formation of Ga2O3 native oxide and possibly Ga2O suboxide, which is known to be an excellent III-V surface passivant. HPWVA is a relatively simple, low-damage, and low-temperature process, and hence, it is found to be a highly feasible and promising alternative for realizing AlGaN/GaN HEMTs with improved performance.

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