Publication not explained

This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.

If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.

Featured Image

Read the Original

This page is a summary of: Investigation of copper reinforced Acrylonitrile Butadiene Styrene and Nylon 6 based thermoplastic polymer nanocomposite filaments for 3D printing of electronic components, High Performance Polymers, July 2022, SAGE Publications,
DOI: 10.1177/09540083221112307.
You can read the full text:

Read

Contributors

The following have contributed to this page