Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon

What is it about?

In the recent research world, the overall system performance primarily depends on interconnect delay instead of the gate delay at the nanoscale regime. The impact of spacing between the lines and shrinking technology are rigorously investigated on peak noise and delay under the crosstalk for rough-edged multi-layered graphene nanoribbon (MLGNR) at global lengths. Using a rough-edged MLGNR, a multi-conductor transmission line (MTL) model is accurately demonstrated by considering the effect of coupling capacitance and inter-layer tunnelling conductance. By incorporating lengths and spacing between the coupled MLGNR interconnect, the equivalent electrical model exhibits an insignificant error of 0.91% only. Moreover, the proposed equivalent model is used to demonstrate the delay under the influence of crosstalk and peak noise for coupled interconnect lines. Using industry standard HSPICE, the overall delay and peak noise under the crosstalk are reduced by 45.1% and 9%, respectively at advanced 14nm technology in comparison to the 32nm for a fixed layer of rough-edged MLGNR based global VLSI interconnects.

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Why is it important?

This work demonstrates the deep insight the impact of technology node and spacing on crosstalk for MLGNR and compared with Cu interconnect.