All Stories

  1. New Insights Into Adsorption of Specific PM2.5 Contaminants Using Au and AGNR Sensors
  2. Adsorption Analysis at Critical Temperature of PM2.5 Contaminants
  3. Impact of a Tubular Dielectric Medium on Peak Noise and Crosstalk Delay in a Coaxial TSV
  4. Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power
  5. Impact of Polymer Liners on Crosstalk Induced Delay of Different TSV Shapes
  6. High-Speed Interconnects: History, Evolution, and the Road Ahead
  7. Compact AC Modeling of Eddy Current for Cylindrical Through Silicon Via
  8. An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power
  9. First Principle Study of Electronic Property of Doped/Undoped Graphene Structure for Interconnect Application
  10. Tunnel FET‐based ultra‐lightweight reconfigurable TRNG and PUF design for resource‐constrained internet of things
  11. Hardware Security Exploiting Post-CMOS Devices: Fundamental Device Characteristics, State-of-the-Art Countermeasures, Challenges and Roadmap
  12. Signal Transmission and Reflection Losses of Cylindrical and Tapered shaped TSV in 3D Integrated Circuits
  13. Adsorption of Carbon Monoxide on Multilayered Graphene
  14. Performance analysis of mixed CNT bundle interconnects at 10 nm technology
  15. Role of Through Silicon Via in 3D Integration: Impact on Delay and Power
  16. Analysis of top- and side-contact MLGNR interconnects: impact on crosstalk, stability, and electromigration
  17. Relative stability of shielded top- and side-contact MLGNR interconnects
  18. Tunnel FET‐based ultralow‐power and hardware‐secure circuit design considering p‐i‐n forward leakage
  19. A Low Area Overhead DPA Countermeasure Exploiting Tunnel Transistor based Random Number Generator
  20. Designing SRAM Using CMOS and CNTFET at 32 nm Technology
  21. Tunnel FET ambipolarity-based energy efficient and robust true random number generator against reverse engineering attacks
  22. Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon
  23. An Efficient Method to Reduce Crosstalk for Multi-layered GNR Interconnects at 32 nm Technology
  24. Signal Integrity Analysis for Diameter-Dependent Mixed Carbon Nanotube Bundle Interconnects
  25. An Efficient Wireless Charging Technique Using Inductive and Resonant Circuits
  26. Analytical Study of Bundled MWCNT and Edged MLGNR Interconnects: Impact on Propagation Delay and Area
  27. Novel Approach for Improved Signal Integrity and Power Dissipation Using MLGNR Interconnects
  28. Performance Analysis of Graphene Based Optical Interconnect at Nanoscale Technology
  29. Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias
  30. Future of Graphene based Interconnecte Technology - A Reality or a Distant Dream
  31. Analysis of propagation delay for bundled SWCNT and bundled MWCNT in global VLSI interconnects
  32. Crosstalk-centric designing using graphene based multi-line bus architecture
  33. Performance analysis of graphene nanoribbon based vertical interconnects — Through silicon vias
  34. Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect
  35. Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV
  36. Signal integrity improvement with peripherally placed MWCNTs in mixed CNT bundle based TSVs
  37. Time and Frequency Domain Analysis of MLGNR Interconnects
  38. Performance analysis of single- and multi-walled carbon nanotube based through silicon vias
  39. Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects
  40. Process-Induced Delay Variation in SWCNT, MWCNT, and Mixed CNT Interconnects
  41. Carbon Nanotube Based VLSI Interconnects
  42. Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges
  43. Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects
  44. Crosstalk and Delay Analysis
  45. Modeling of Carbon Nanotube Interconnects
  46. Interconnects
  47. Mixed Carbon Nanotube Bundle
  48. Carbon Nanotube: Properties and Applications
  49. Performance analysis for randomly distributed mixed carbon nanotube bundle interconnects
  50. Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects
  51. Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects
  52. Analysis of crosstalk delay using mixed CNT bundle based through silicon vias
  53. Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path
  54. Dynamic crosstalk analysis of mixed multi-walled carbon nanotube bundle interconnects
  55. Effect of polymer liners in CNT based through silicon vias
  56. Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via
  57. Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream
  58. Propagation Delay Analysis for Bundled Multi-Walled CNT in Global VLSI Interconnects
  59. Analysis of Crosstalk Deviation for Bundled MWCNT with Process Induced Height and Width Variations
  60. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects
  61. Dynamic crosstalk effect in CNT bus architecture
  62. Optimized delay and power performances in multilayer graphene nanoribbon interconnects
  63. Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects
  64. Novel modeling approach for multi-walled CNT bundle in global VLSI interconnects
  65. Analysis of crosstalk delay and power dissipation in mixed CNT bundle interconnects
  66. Optimized delay and power performances for multi-walled CNT in global VLSI interconnects
  67. Dynamic crosstalk effect in multi-layer graphene nanoribbon interconnects
  68. Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation
  69. Comparison of propagation delay in single- and multi-layer graphene nanoribbon interconnects
  70. Effect of dielectric thickness on performance of dual gate organic field effect transistors
  71. Crosstalk effect in coupled interconnect lines using FDTD method
  72. Dynamic Crosstalk Analysis in RLC Modeled Interconnects Using FDTD Method
  73. Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area
  74. Performance Comparision of Mixed CNT Bundle in Global VLSI Interconnect
  75. Novel VLSI architecture for two-dimensional radon transform computations
  76. Analysis of crosstalk delay and area for MWNT and bundled SWNT in global VLSI interconnects
  77. Comparison of crosstalk delay between single and bundled SWNT for global VLSI interconnects
  78. Independent Gate SRAM Based on Asymmetric Gate to Source/Drain Overlap-Underlap Device FinFET
  79. Low Complexity Encoder for Crosstalk Reduction in RLC Modeled Interconnects
  80. Dynamic crosstalk effect in mixed CNT bundle interconnects
  81. Modified PPPE architecture for two-dimensional Radon Transform computation
  82. Comparison of propagation delay characteristics for single-walled CNT bundle and multiwalled CNT in global VLSI interconnects
  83. Propagation delay deviations due to process induced line parasitic variations in global VLSI interconnects
  84. Performance comparison between single wall carbon nanotube bundle and multiwall carbon nanotube for global interconnects
  85. Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects
  86. Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects
  87. Performance analysis of multi-walled carbon nanotube based interconnects