What is it about?
The paper describes the changes of sintered Ag in terms of microstructure and shear strength when they are aged at high temperature. High temperature is common during applications. Sintered Ag is silver used to join semiconductor chip to the chip carrier. Sintered Ag has high thermal and electrical properties than current conventional solder. Since it is only silver, it is environmentally friendly and lead-free.
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Why is it important?
Changes in microstructure and strength affect the reliability of this technology. it depends on the substrates or interfaces used during the bonding process
Perspectives
it continues on the work by pioneers like Samjid Mannan (KCL), GQ Lu (Virginia Tech) & Joe Mei (Tianjin Uni) on this topic of reliability of sintered Ag at high temperatures.
Dr Kim S Siow
Universiti Kebangsaan Malaysia
Read the Original
This page is a summary of: Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C, Journal of Alloys and Compounds, December 2016, Elsevier,
DOI: 10.1016/j.jallcom.2016.06.132.
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