All Stories

  1. Low pressure plasma modifications for the generation of hydrophobic coatings for biomaterials applications

    Article • July 2018, Wiley

    Dr Kim S Siow

  2. Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm 2 ) power chips for electronics packaging

    Article • Journal of Materials Processing Technology, May 2018, Elsevier

    Dr Kim S Siow

  3. Peranti Suis Sistem Nanoelektromekanikal (NEMS) Berunsurkan Grafin dan Tiub Nano Karbon (CNT)

    Article • Sains Malaysiana, March 2018, Penerbit Universiti Kebangsaan Malaysia (UKM Press)

    Dr Kim S Siow

  4. Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material

    Article • Materials Letters, November 2017, Elsevier

    Dr Kim S Siow

  5. Enhancing biocompatibility of the polymers by plasma technique

    Article • Materials Science and Engineering C, October 2017, Elsevier

    Mr Tiam Foo Chen, Dr Kim S Siow

  6. Three-Dimensional Finite Element Method Simulation of Perforated Graphene Nano-Electro-Mechanical (NEM) Switches

    Article • Micromachines, July 2017, MDPI AG

    Dr Kim S Siow

  7. Pengelupasan Grafit untuk Mengkomersilkan Teknologi Grafin

    Article • Sains Malaysiana, July 2017, Penerbit Universiti Kebangsaan Malaysia (UKM Press)

    Dr Kim S Siow

  8. Stress analysis of perforated graphene nano-electro-mechanical (NEM) contact switches by 3D finite element simulation

    Article • Microsystem Technologies, July 2017, Springer Science + Business Media

    Dr Kim S Siow

  9. High-temperature Pb-free die attach material project phase 1: Survey result

    Article • April 2017, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  10. Microstructural studies of sintered Ag aged at 300C

    Article • Journal of Alloys and Compounds, December 2016, Elsevier

    Dr Kim S Siow

  11. Guiding and confinement of interface acoustic waves in solid-fluid pillar-based phononic crystals

    Article • AIP Advances, December 2016, American Institute of Physics

    Dr Kim S Siow

  12. Plasma polymerized carvone as an antibacterial and biocompatible coating

    Article • Materials Science and Engineering C, November 2016, Elsevier

    Dr Kim S Siow

  13. Patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging

    Article • September 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  14. Solid-fluid interaction in a pillar-based phononic crystal

    Article • August 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  15. Optimization of beam length and air gap of suspended graphene NEMS switch for low pull-in voltage application

    Article • August 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  16. Plasma Polymers Containing Sulfur and Their Co-Polymers With 1,7-Octadiene: Chemical and Structural Analysis

    Article • Plasma Processes and Polymers, July 2016, Wiley

    Dr Kim S Siow

  17. Ageing properties of PUMA and OSTE after plasma treatment

    Article • Journal of Applied Polymer Science, July 2016, Wiley

    Mr Tiam Foo Chen, Professor Chwee Teck Lim, Dr Kim S Siow

  18. Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

    Article • Journal of Electronic Packaging, May 2016, ASME International

    Dr Kim S Siow

  19. Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

    Article • Journal of Electronic Packaging, April 2016, ASME International

    Dr Kim S Siow

  20. TRIZ technique to produce stable plasma modified surfaces with high density of reactive chemical functionalities

    Article • October 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow, Mr Tiam Foo Chen

  21. Characterization of silicone gel properties for high power IGBT modules and MEMS

    Article • October 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow, Mr Tiam Foo Chen

  22. Electrical conductivity of porous silver made from sintered nanoparticles

    Article • Electronic Materials Letters, March 2015, Springer Science + Business Media

    Dr Kim S Siow

  23. Setting up an intellectual properties intermediary service: DMAIC way

    Article • December 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  24. Effect of sintering atmosphere on the shear properties of pressureless sintered silver joint

    Article • November 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  25. Low-Pressure Plasma Methods for Generating Non-Reactive Hydrophilic and Hydrogel-Like Bio-Interface Coatings - A Review

    Article • Plasma Processes and Polymers, September 2014, Wiley

    Dr Kim S Siow

  26. Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

    Article • August 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  27. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

    Article • Journal of Electronic Materials, January 2014, Springer Science + Business Media

    Dr Kim S Siow

  28. Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus

    Article • Plasma Processes and Polymers, January 2014, Wiley

    Dr Kim S Siow

  29. Sintered silver (Ag) as lead-free die attach materials

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  30. Mechanical properties of nano-silver joints as die attach materials

    Article • Journal of Alloys and Compounds, February 2012, Elsevier

    Dr Kim S Siow

  31. Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films

    Article • Plasma Processes and Polymers, August 2009, Wiley

    Dr Kim S Siow

  32. Plasma Methods for the Generation of Chemically Reactive Surfaces for Biomolecule Immobilization and Cell Colonization - A Review

    Article • Plasma Processes and Polymers, August 2006, Wiley

    Dr Kim S Siow

  33. Characterization of sulfate and phosphate containing plasma polymer surfaces

    Article • January 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Kim S Siow

  34. Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate

    Article • Materials Science and Engineering A, September 2005, Elsevier

    Dr Kim S Siow

  35. A STUDY ON MICROSTRUCTURAL AND MECHANICAL PROPERTIES OF NANOCRYSTALLINE NICKEL

    Article • International Journal of Nanoscience, August 2005, World Scientific Pub Co Pte Lt

    Dr Kim S Siow

  36. Mechanical properties of nanocrystalline copper and nickel

    Article • Materials Science and Technology, March 2004, Taylor & Francis

    Dr Kim S Siow

  37. Correlation between intermetallic thickness and roughness during solder reflow

    Article • Journal of Electronic Materials, August 2001, Springer Science + Business Media

    Dr Kim S Siow

  38. Pitting corrosion of duplex stainless steels

    Article • Anti-Corrosion Methods and Materials, February 2001, Emerald

    Dr Kim S Siow

  39. Fracture of a Lead-Tin and a Tin-Silver Solder Under Combined Tensile Shear Loading

    Article • MRS Proceedings, January 1999, Cambridge University Press

    Dr Kim S Siow

  40. On the Shear Strength and Mixed-mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder

    Article • MRS Proceedings, January 1998, Cambridge University Press

    Dr Kim S Siow