What is it about?
Bonding copper foam to a graphene/aluminum nitride ceramic at 760°C creates a TiC atomic heat bridge. Titanium-carbon bonds reduce vibration mismatch, raising heat flow to 160.59 W/(m·K). The foam also makes coolant turbulent, cooling 12 times faster (2.09°C/s). This atomic bridge and foam design has the ability to cool high-power electronics better than currenty used techniques.
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Why is it important?
This atomic bonding plus foam design boosts heat conduction and cooling enabling smaller, faster, safer chips and energy savings.
Read the Original
This page is a summary of: Phonon bridging at atomically bonded Cu-graphene/AlN interfaces enables synergistic conduction and convective cooling, Transactions of Materials Research, September 2026, Elsevier,
DOI: 10.1016/j.tramat.2026.100428.
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