All Stories

  1. Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging

    Article • Solid State Phenomena, August 2018, Trans Tech Publications

    Miss Rita Mohd Said

  2. Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste

    Article • Solid State Phenomena, August 2018, Trans Tech Publications

    Miss Rita Mohd Said

  3. Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

    Article • Key Engineering Materials, July 2016, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  4. Improvement of Sn-0.7Cu Lead Free Solder Joints on Shear Strength with Addition of Titanium Oxide (TiO2) Particles

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  5. The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy

    Article • Materials Science Forum, June 2015, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  6. Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

    Article • Materials Science Forum, June 2015, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  7. Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said

  8. Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said

  9. Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  10. Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  11. Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said

  12. The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

    Article • Applied Mechanics and Materials, April 2015, Trans Tech Publications

    Miss Rita Mohd Said

  13. The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

    Article • Materials Science Forum, August 2014, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman

  14. Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

    Article • Materials Science Forum, August 2014, Trans Tech Publications

    Miss Rita Mohd Said, Dr Mohd Nazree bin Derman