What is it about?
This paper demonstrates an engineering design and analysis tool - a structural-level parametric pi-joint finite element model - and showcases a straightforward approach to multiscale modeling by incorporating the influence of mesoscale three-dimensional textile representative volume elements (RVEs) in the macroscale response of a bonded composite pi-joint through a classical linear elastic homogenization approach. Based on global sensitivity analysis, the biggest drivers of uncertainty in the multiscale model predictions are uncertainty and variability in pi-joint geometry and the cohesive zone model parameters that model adhesive bond failure in the simulations. Additional experiments will be performed to further develop the multiscale pi-joint model.
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Why is it important?
A computational framework has been developed for multiscale modeling of bonded composite pi-joints using a classical linear elastic homogenization approach to link mesoscale three-dimensional textile representative volume element (RVE) predictions with structural-level pi-joint simulations. Global These sensitivity study results are being used to guide additional experiments and model development activities with the goal of reducing risk in design and certification of bonded composite structures.
Perspectives
This paper documents a small piece of the collaborative work that is being performed as part of a much larger program that aims to develop validated process-to-performance (P2P) models and methods to predict the static response and fatigue life of bonded composite structures. We hope you find this work interesting and that it meaningfully contributes to the discussion on the necessary modeling and simulation capabilities to reduce risk in design and certification of bonded composite structures.
Matthew Kirby
Southwest Research Institute
Read the Original
This page is a summary of: Probabilistic Sensitivity Studies of a Multiscale Process-to-Performance Model for Bonded Composite Pi-joints, January 2024, American Institute of Aeronautics and Astronautics (AIAA),
DOI: 10.2514/6.2024-2283.
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