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This page is a summary of: (Dielectric Science and Technology Division Poster Award, 1st Place) The Influence of Pad Micro-Features on Chemical Mechanical Polishing (CMP) Performance: Insights from Computational Fluid Dynamics (CFD), ECS Meeting Abstracts, August 2024, The Electrochemical Society,
DOI: 10.1149/ma2024-01201267mtgabs.
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