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This page is a summary of: Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7), November 2012, Institute of Electrical & Electronics Engineers (IEEE),
DOI: 10.1109/iemt.2012.6521765.
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