What is it about?
Voids, or empty region between chips formed in underfilling could be made more likely with its solder ball arrangement and how it is being joint. We show for the first time how these factor influence each other through deep learning analysis and correlational study.
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Why is it important?
We can uncover findings relating ball-grid array pattern and dispensing parameter to void location.
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This page is a summary of: Deep learning and analytical study of void regional formation in flip-chip underfilling process, Soldering & Surface Mount Technology, October 2023, Emerald,
DOI: 10.1108/ssmt-06-2023-0028.
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