What is it about?
Voids, or empty region between chips formed in underfilling could be made more likely with its solder ball arrangement and how it is being joint. We show for the first time how these factor influence each other through deep learning analysis and correlational study.
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Photo by Slejven Djurakovic on Unsplash
Why is it important?
We can uncover findings relating ball-grid array pattern and dispensing parameter to void location.
Perspectives
While the finding has began, it can be further improved through the means of updating the CNN model used coupled with image processing method to capture more accurate shape, and potentially leading to a further finding such as crack prediction.
Calvin Ling
Universiti Sains Malaysia
Read the Original
This page is a summary of: Deep learning and analytical study of void regional formation in flip-chip underfilling process, Soldering & Surface Mount Technology, October 2023, Emerald,
DOI: 10.1108/ssmt-06-2023-0028.
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