What is it about?
The main aims of this work are the validation of the developed process of gluing a single-mode optical fiber array with a photonic chip and the selection of a more suitable adhesive from the two adhesives being compared. An active alignment system was used for adjusting the two optical fiber arrays to a photonics chip. The gluing was done by two compared UV curable adhesives applied in the optical path. The insertion losses of glued coupling were measured and investigated at two discrete wavelengths 1310 nm and 1550 nm during temperature testing in the climatic chamber according to Telcordia GR_1209_Corei04.
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Why is it important?
The measurement, investigation, and comparison of insertion losses of the glued coupling at the spectral band from 1530 nm to 1570 nm were done immediately after gluing process and after three temperature cycles in the climatic chamber with one month delay.
Perspectives
We report on active alignment and gluing of two optical fiber arrays to photonics chip of optical power splitter 1x8 by two different UV epoxy adhesive and on followed measurement and investigation of temperature changes of insertion losses during three temperature cycles from -40 °C to 80 °C in climatic chamber. The results of the experiments show the correctness of the developed technological procedure of adjusting and gluing fiber arrays to the photonic chip with UV adhesive.
Jozef Chovan
SLOVAK CENTRE OF SCIENTIFIC AND TECHNICAL INFORMATION
Read the Original
This page is a summary of: Temperature stability investigation of fiber array to photonics chip butt coupling, January 2023, American Institute of Physics,
DOI: 10.1063/5.0143468.
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