This shareable PDF can be hosted on any platform or network and is fully compliant with publisher copyright.
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
This page is a summary of: Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties, Journal of Alloys and Compounds, November 2017, Elsevier,
DOI: 10.1016/j.jallcom.2017.06.329.
You can read the full text:
The following have contributed to this page
