This shareable PDF can be hosted on any platform or network and is fully compliant with publisher copyright.
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
This page is a summary of: Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0Ag–0.5Cu solder as barrier, Journal of Materials Science Materials in Electronics, September 2017, Springer Science + Business Media,
DOI: 10.1007/s10854-017-7859-5.
You can read the full text:
The following have contributed to this page
