All Stories

  1. Process Parameters Used in Macro/Micro Powder Injection Molding: An Overview

    Article • Metals and Materials International, June 2020, Springer Science + Business Media

    Nashrah Hani Jamadon

  2. Bi-Material Micro-Part of Stainless Steel and Zirconia by Two-Component Micro-Powder Injection Molding: Rheological Properties and Solvent Debinding Behavior

    Article • Metals, May 2020, MDPI AG

    Nashrah Hani Jamadon

  3. Integrated System Technology of POME Treatment for Biohydrogen and Biomethane Production in Malaysia

    Article • Applied Sciences, February 2020, MDPI AG

    Nashrah Hani Jamadon

  4. Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

    Article • Welding in the World, November 2019, Springer Science + Business Media

    Nashrah Hani Jamadon

  5. Feasibility study on autogenously lap joint between non-ferrous metal alloys using low power fiber laser

    Article • October 2019, SPIE

    Nashrah Hani Jamadon

  6. Effect of Isothermal Aging on Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Alloy with Porous Cu Interlayer Addition

    Article • January 2017, Springer Science + Business Media

    Nashrah Hani Jamadon

  7. Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

    Article • Metals, September 2016, MDPI AG

    Nashrah Hani Jamadon

  8. Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application

    Article • November 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Nashrah Hani Jamadon

  9. Formation behaviour of reaction layer in Sn-3.0Ag-0.5Cu solder joint with addition of porous Cu interlayer

    Article • IOP Conference Series Materials Science and Engineering, August 2014, Institute of Physics Publishing

    Dr farazila yusof, Nashrah Hani Jamadon

  10. Effect of adding porous Cu on the microstructure and mechanical properties of Pb-free solder joint

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr farazila yusof, Nashrah Hani Jamadon