All Stories

  1. An intelligent wire fault diagnosis approach using time domain reflectometry and pattern recognition network
  2. Efficient Analytical Prediction of the EMI Bandgap Limits of PEC-PMC Metallic Enclosures Hosting RF and Digital Circuits
  3. TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization
  4. Analysis of Near-Field Emissions From Common-Mode Filters Based on EBG Structures
  5. Near-Field Shielding Performances of EMI Noise Suppression Absorbers
  6. TDR based wire fault diagnosis
  7. CBO-Based TDR Approach for Wiring Network Diagnosis
  8. Approximate Versus Exact Near Field Formulation for a Cylindrical Electric Dipole
  9. Electric Dipole Equations in Very-Near-Field Conditions for Electromagnetic Shielding Assessment—Part II: Wave Impedance, Reflection, and Transmission
  10. Electric Dipole Equations in Very Near Field Conditions for Electromagnetic Shielding Assessment. Part I: Radiation Equations
  11. Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-Like Remote Monitoring
  12. Reduction of EMI Due to Common-Mode Currents Using a Surface-Mount EBG-Based Filter
  13. Band-gap limits prediction for effective noise coupling reduction in microwave circuits metallic enclosures
  14. Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer
  15. Resonant EBG-based common mode filter for LTCC substrates
  16. Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling
  17. Impact of Voltage Bias on Through Silicon Vias (TSV) depletion and crosstalk
  18. Optimization procedure for removable EBG common mode filter design
  19. Performance Optimization of EBG-Based Common Mode Filters for Signal Integrity Applications
  20. Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis
  21. Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias
  22. EBG-Based Common-Mode Stripline Filters: Experimental Investigation on Interlayer Crosstalk
  23. Equivalent Circuit Modeling in Time Domain of the Hysteresis of Magnetic Materials
  24. Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects
  25. EBG-Based Common-Mode Microstrip and Stripline Filters: Experimental Investigation of Performances and Crosstalk
  26. An advanced transmit/receive 3D ceramic hybrid circuit module for space applications
  27. Mitigating the threat of crosstalk and unwanted radiation when using electromagnetic bandgap structures to suppress common mode signal propagation in PCB differential interconnects
  28. Removable EBG-Based Common-Mode Filter for High-Speed Signaling: Experimental Validation of Prototype Design
  29. Dynamically reconfigurable metamaterials for shielding and absorption in the GHz range
  30. Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance
  31. Efficient modeling of array of through silicon vias
  32. Impact of Frequency-Dependent and Nonlinear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit
  33. Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity
  34. Reconfigurable photoinduced metamaterials in the microwave regime
  35. Miniaturization approach for EBG-based common mode filter and interference analysis
  36. Non-Destructive Testing in Complexes Cabling Networks using Time Domain Reflectometry and Particle Swarm Optimization
  37. Sensitivity analysis of electromagnetic transmission, reflection and absorption coefficients for biphasic composite structures
  38. Standalone removable EBG-based common mode filter for high speed differential signaling
  39. Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model
  40. Design of Homogeneous and Composite Materials From Shielding Effectiveness Specifications
  41. Histogram density for the Feature Selective Validation (FSV) method
  42. Investigating Confidence Histograms and Classification in FSV: Part I. Fuzzy FSV
  43. Investigating Confidence Histograms and Classification in FSV: Part II-Float FSV
  44. Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties
  45. Impact of planar electromagnetic band-gap structures on IR-DROP and signal integrity in high speed printed circuit boards
  46. Evaluation of dielectric permittivity for homogeneous materials from transmittance requirements
  47. Optimum geometrical parameters for the EBG-based common mode filter design
  48. Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures
  49. From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics—Part II: Random Cylindrical Inclusions
  50. Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes
  51. ACCURATE AND EFFICIENT ANALYSIS OF PLANAR ELECTROMAGNETIC BAND-GAP STRUCTURES FOR POWER BUS NOISE MITIGATION IN THE GHZ BAND
  52. HOMOGENIZED PERMITTIVITY OF COMPOSITES WITH ALIGNED CYLINDRICAL INCLUSIONS FOR CAUSAL ELECTROMAGNETIC SIMULATIONS
  53. Practical EBG application to multilayer PCB: Impact on power integrity
  54. From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions
  55. Full-wave EMC simulations using Maxwell Garnett model for composites with cylindrical inclusions
  56. Compact configuration of a planar EBG based CM filter and crosstalk analysis
  57. A Simple and Efficient Design Procedure for Planar Electromagnetic Bandgap Structures on Printed Circuit Boards
  58. Routing strategies for improving common mode filter performances in high speed digital differential interconnects
  59. Rapid Rotary Scanner and Portable Coherent Wideband Q-Band Transceiver for High-Resolution Millimeter-Wave Imaging Applications
  60. Design of a Common Mode Filter by Using Planar Electromagnetic Bandgap Structures
  61. Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters
  62. Block Analysis of a Voltage Supply Chain: Mixed Electromagnetic Modeling and Validation
  63. IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
  64. Impact of Shorting Vias Placement on Embedded Planar Electromagnetic BandGap Structures Within Multilayer Printed Circuit Boards
  65. Measurement of differential mode propagation in printed circuit board for satellites applications
  66. Experimental validation of common-mode filtering performances of planar electromagnetic band-gap structures
  67. Equivalent circuit models for evaluation of bandgap limits for planar electromagnetic bandgap structures
  68. Signal integrity analysis of embedded planar EBG Structures
  69. Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology
  70. Performance of signal link paths in presence of signal reference planes of EBG type
  71. Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures
  72. Common mode filtering performances of planar EBG structures
  73. Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I - microstrip lines
  74. An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB
  75. Characterization of serial links at 5.5Gbps on FR4 backplanes
  76. Return via connections for extending signal link path bandwidth of via transitions
  77. Efficient prediction of RF interference in a shielding enclosure with PCBs using a general segmentation method
  78. Using TWDP to quantify channel performance with frequency-domain s-parameter data
  79. Closed-form expressions for determining approximate PMC boundaries around an aperture in a metal cavity wall
  80. Aperture modeling using a hybrid method for RFI analysis
  81. Link path design on a block-by-block basis
  82. Modeling multilayer power distribution network by systematically incorporating via and cavity models